Embedded Computing
NEXCOM is leading in embedded computing technology and provides one-stop solution for diversified vertical markets. To fulfill various industrial requirements, NEXCOM Embedded Computing offers rich off-the-shelf, standardized industrial from factor product lines, including COM Computer-on-Module, 3.5'' / 5.25'' SBC, Mini-ITX MB, and ARM/SoC Solutions. Available from ultra-low power to high performance quad cores processors, NEXCOM's reliable embedded computing solutions make your embedded dreams work.
3.5'' / 5.25'' SBC EBC 355
EBC 355
3.5" SBC On-board Intel® Atom™ Processor E3800 Product Family HDMI/ VGA/ 1x24/48-bit LVDS Dual Channel, Dual Mini-PCIe- Main Feature
- On-board Intel® Atom™ Processor E3800 Product Family
- One 204-pin SO-DIMM socket supports up to 8 GB DDR3L 1066/1333 MHz SDRAM
- Display: HDMI/ VGA/ 1x LVDS (2x DF13 20-pin 18/ 24-bit Single channel)
- 2x Mini-PCIe
- 2x Intel® i210 PCI Express Gigabit Ethernet
- 2x SATA2.0
- 4x USB3.0, 4-in/ 4-out GPIO, Mic-in , Speak out
- Serial port: 3x RS232, 1x RS232/422/485 port
- Support AT/ ATX mode and single +12VDC input
| CPU Support | Support Intel® Atom™ processor E3800 product family |
| Main Memory | Single 204-pin SO-DIMM socket supports up to 8 GB DDR3L 1066/1333 MHz SDRAM |
| Platform Control Hub | Atom™ processor E3800 product family (formerly codenamed "Bay Trail-I") |
| BIOS | AMI System BIOSPlug and play supportAdvanced Power Management and Advanced Configuration & Power Interface support |
| Display | Integrated Intel® Gen.7 Graphics EngineSupports VGA and HDMI interfaceAnalog VGA interface: 1xDB-15 connector, resolution up to 1920 x 1200 @75HzHDMI interface: 1x HDMI connector, resolution up to 1920 x 1200LVDS interface: 1x dual (24/48-bit) LVDS panel, resolution up to 1920 x 1200 DF13 20-pin LVDS connector for internal connection |
| Audio | Realtek ALC886 CODEC for High Definition: 1x 4 2.0 pitch pin-header for MIC-in 1x 4 2.0 pitch pin-header for Line out 1x 5 2.0 pitch pin-header for speaker out |
| On-board LAN | 2x Intel® i210 Gigabit EthernetSupport PXE boot from LAN, wake on LAN function |
| Expansion | 2x Mini-PCIe |
| I/O Interface | Serial port: 4 ports COM1, 3, 4 support RS232 with 10-pin box header COM2 support RS232/422/485 with 10-pin box headerUSB3.0: 4 ports 4 x ports edge connector8 GPIO lines via header (GPI 0~3 and GPO0~3) TTL level (0/5V)On-board power LED and HDD active LED pin header1 x 4-pin fan connector (for CPU)1 x keyboard/mouse pin headerOnboard buzzer/SMBus2.0/reset SW/o n & off switch button |
| Edge I/O Interface | 1 x VGA connector1 x HDMI connector2 x dual stack USB3.0 connector2 x RJ45 with LED connector |
| Watchdog Timer | Watchdog time-out can be programmable by software from 1 second to 255 seconds and from 1 minute to 255 minutes (tolerance 15% under room temperature 25°C) |
| Storage | 2 x SATA2.0 ports |
| System Monitor | Monitoring of 4 voltages and 2 temperatures4 voltage (Vcore, +12V, +3.3V, 5V)2 temperatures (CPU, system)1 fan speed detection |
| On-board RTC | On-chip RTC with battery backup1 x external Li-ion battery |
| Power Requirements | Power requirement: +12V DC InputOne 4-pin power connector |
| Dimensions | 146mm (L) x 102mm (W) 5.7" x 4.0" |
| Environment | Board Level Operating temperatures: -20°C to 60°CStorage temperatures: -25°C to 85°CRelative humidity: 10% to 90% (operating, non-condensing) 5% to 95% (non-operating, non-condensing) |
| Certifications | Meet CEFCC Class A |
Mini-ITX MB-NEX 614
NEX 614 is a Mini-ITX board with 6th generation Intel® Core™ i7/i5/i3 processors and Intel® Celeron® processors (codenamed Skylake) and as well as next generation Intel® Core™/Celeron® processors which integrated Intel® Skylake graphic controller. NEX 614 supports multi-displays by HDMI (4K/2K), DP, VGA and LVDS (dual channel 24-bit up to 1920 x 1200 @60Hz). With dual DDR4 SO-DIMM channel, the maximum memory supports up to 32GB.
NEX 614 embedded Intel® H110 as default provides three SATA, four serial ports, four USB 3.0 ports, four USB 2.0 ports, two Gigabit Ethernet LAN port, one PCIe x16 slot and one full size mini-PCIe with 3G/Wi-Fi/mSATA interface. The power input covers from 12V to 24V DC. With optional Intel® Q170 chipset, NEX 614 expends 4th SATA function for mass storage. NEX 614 features versatile displays, riches I/O support for multimedia as well as critical mission of industrial embedded applications, such as Kiosk, digital signage, gamming, automation applications...etc.
NEX 614
Mini-ITX, 6th Generation Intel® Core™ i7/ i5/ i3 Celeron® Process Family with H110, VGA, HDMI, DP, LVDS, mini-PCIe, 2 x GbE/10 x USB/4 x COM, 12V~24V DC Input- Main Feature
- Support socket LGA1151 for 6th generation Intel® Core™ i7/i5/i3 and Intel® Celeron® processors (codenamed Skylake) or next generation Intel® Core™/Celeron® processors
- Intel® Q170/H110 chipset
- 2 x 260-pin SO-DIMM DDR4 up to 32GB
- Triple display: HDMI/DP/VGA/LVDS
- 2 x GbE with Intel® I219LM and i211-AT
- 1 x Full size mini-PCIe
- 4 x SATA 3.0
- 4 x COM, 7 x USB, 4-in/4-out GPIO, HD Audio
- 1 x PCIe x16
- DC +12V~24V input ±5%
| CPU Support | Socket LGA1151, Intel® 6th and next generation Core™ i7/i5/i3 processor and Intel® Celeron® processors,14nm process |
| Main Memory | Dual DDR4/SO-DIMMs, up to 32GB |
| Chipset | Intel® H110 PCHIntel® Q170 PCH as optional |
| BIOS | AMI system BIOSPlug and play support |
| On-board LAN | 2 x RJ45 connectors with Intel® I219LM and i211-AT GbE controllerSupport PXE boot from LAN, wake on LAN function |
| Display | 1 x HDMI 1.4 connector (resolution up to 4K/2K@30Hz)1 x DP 1.2 connector (resolution up to 4096 x 2304)1 x VGA (resolution up to 1920 x 1200)1 x LVDS (support dual port 24-bit) |
| Expansion Slot | 1 x mini-PCI express slot support mSATA, Wi-Fi module and 3G module built with card holder |
| I/O Interface | COM1/3/4: RS232, 9-pin wafer with cable JST connectorCOM2 : RS232/422/485, 1 x DB9 male connector on edge I/OUSB 2.0/3.0: 7 ports - USB 3.0 x 4 ports edge connector - USB 2.0 x 3 ports by 2.54mm pin connector4-in/4-out GPIO2 x 7-pin header with PWR button/reset button/PWR LED/HDD LED1 x 4-pin fan connector support PWM fan1 x 3-pin system fan |
| Storage | 3 x 7-pin SATA 6Gb/s connector; one supports SATA-DOM4th SATA connector reserved for Q170 as optional to support RAID 0/1/52 x 4-pin connector for SATA power |
| Audio | Realtek ALC886 HD codec |
| Power Requirements | AT/ATX mode (by jumper setting default-AT)4-pin power connector (right angle) for DC power input+12V~24V DC input (with ±5%) |
| Optional function | TPM module (EBK-TPM) |
| Dimensions | 170mm (L) x 170mm (W) (6.7”x 6.7”) |
| Environment | Board level operating temperatures: 0˚C to 60˚CRelative humidity: - 10% to 90% (operating, non-condensing) - 5% to 95% (non-operating, non-condensing) |
| Certifications | Meet CEFCC Class A |
Computer-on-Module
The ICES 268 is a Type 2 COM Express Basic Module featuring Intel® QM77 PCH (option HM76) chipset supports Intel® 3rd generation Intel® Core™ i7/i5/i3 rPGA988 processors up to i7-3610QE (4x 2.3Ghz/ max. TDP 45W) with two DDR3 SO-DIMMs 1333/1600MHz non-ECC up to 16GB.
The 3rd Generation Core i7/ i5/ i3 processors integrated with Intel® HD graphics with DX11 support one PCIex16 (Gen 3.0) to carrier board. The optional 1 x DDI interfaces port B, allows ICES 268 implement SDVO to HDMI, DVI, DP port by add-in EBK-A2HDMI. The high performance ICES 268 COM Express Basic Module supports 4x SATA3.0/ 2.0, 8x USB 2.0, 5x PCIex1 lanes and 1x Gigabit Ethernet through the carrier board; NEXCOM is offering standard Type 2 carrier board, ICEB 8050C as well as hardware-ready evaluation starter-kit, ICEK 8050C-T2 build-in 10.4” LCD panel, Flex-ATX power supply to help device makers and equipment builders may evaluate full set of I/O function and add-in cards at early development stage.
ICES 268
COM Express™ Type 2, Basic Module with QM77 Intel® 3rd Generation Intel® Core™ rPGA988 Embedded Processors Family- Main Feature
- Intel® 3rd generation Intel® Embedded Core™ rPGA988 embedded processors family
- Intel® QM77 PCH (HM76) chipset support PICMG COM.0 Rev. 2.0 Type 2, pin-outs
- Support two DDR3 SO-DIMMs 1333/1600 non-ECC up to 16GB
- Support PCIex16 (Gen3.0), 5x PCIex1, 8x USB2.0, 2x SATA3.0/ 2x SATA2.0 and 1x GbE
- Support VGA, dual channels 18/24-bit LVDS and optional 1x DDI/ SDVO by PEG
- Dimension: 95mm (mm) x 125mm (L)
| CPU Support | Support Intel® 3rd generation Core™ i7/i5/i3 embedded rPGA988 processors – Intel® Core™ i7-3610QE (4x 2.3GHz/ 6MB cache/ Max. TDP 45W) – Intel® Core™ i7-3610ME (2x 2.7GHz/ 3MB cache/ Max. TDP 35W) – Intel® Celeron® B810 (2x 1.6GHz/ 2MB cache/ Max. TDP 35W) |
| Main Memory | Two DDR3 SO-DIMMs, 1333/1600 MHz SDRAM non-ECC up to 16GB |
| Platform Control Hub | Intel® QM77 PCH (option HM76) chipset |
| BIOS | AMI UEFI System BIOSPlug and play supportAdvanced Power Management and ACPI support |
| Display | Intel® HD graphics with DX11 support and supports Triple independent displaysOne PCI Express x16 Lane (Gen 3.0) down to the carried boardSupports VGA, single/dual channels LVDS 18/24-bit interfacesOptional 1x DDI port B support HDMI, DVI, DisplayPort and SDVO by PEG with EBK-A2HDMI |
| Audio | HD audio interface |
| On-board LAN | Intel® 82579LM Gigabit Ethernet, support iAMT 8.0 (supported by QM77 only)Support boot from LAN, wake on LAN functionSignals down to I/O board |
| COM Express Connector | AB VGA/ LVDS/ 8x USB 2.0, HD Audio/ 2x SATA3.0, 2x SATA 2.0/ GbE/ GPIO/ LPC bus/ 5 x PCIex1/ SMBus (I2C)/ SPI BIOS / SPK outCD PCIex16 (Gen. 3.0) / PCI (v2.3)/ IDE |
| Power Requirements | +12V, +5VSB, +3.3V RTC power |
| Dimensions | 95mm (W) x 125mm (L) |
| Environment | Operating temperature: -15°C to 60°CStorage temperature: -20°C to 80°CRelative humidity: 10% to 90% (operating, non-condensing); 5% to 95% (non-operating, non-condensing) |
| Certifications | Meet CEFCC Class A |
