Industrial Rackmount Computer
NEXCOM Industrial Rackmount Computer is a reliable and cost effective rackmount chassis solution which can fit for various requirements by incorporating an industrial standard ATX motherboard, or combining a single board computer and a passive backplane rackmount computer. As a full service manufacturer, NEXCOM Industrial Rackmount Computer not only produces quality products but also provides responsive services and full supports. We have friendly and knowledgeable professionals to meet for customers' needs and help achieve the success they look for.
PEAK 779VL2
PEAK 779VL2
Overview
PEAK 779VL2
PICMG1.0 Full-size SBC with Intel® B75 Support Intel® 3rd generation Core™ i7/i5/i3 processors- Main Feature
- Scalable platform 3rd generation Intel® Core™ i7/i5/i3 processors + non-ECC
- Intel® B75 PCH chipset support PICMG1.0 specification
- Support Dual channel DDR3 with Non-ECC DIMMs 1333/1600MHz, up to 16GB
- Support PCI/ISA, 4 x USB3.0/4 x USB2.0, 1 x SATA3.0/3 x SATA2.0 and 2 x GbE
- Display support for VGA, DVI, HDMI
- Dimension 338.58mm (L) x 122mm (W) (8 layers single side)
Features
PEAK 779VL2
PICMG1.0 Full-size SBC with Intel® B75 Support Intel® 3rd generation Core™ i7/i5/i3 processors- Main Feature
- Scalable platform 3rd generation Intel® Core™ i7/i5/i3 processors + non-ECC
- Intel® B75 PCH chipset support PICMG1.0 specification
- Support Dual channel DDR3 with Non-ECC DIMMs 1333/1600MHz, up to 16GB
- Support PCI/ISA, 4 x USB3.0/4 x USB2.0, 1 x SATA3.0/3 x SATA2.0 and 2 x GbE
- Display support for VGA, DVI, HDMI
- Dimension 338.58mm (L) x 122mm (W) (8 layers single side)
Specifications
| CPU Support | Support Intel® LGA1155, 3rd generation Intel® Core™ processorIntel® Core i7-3770 (4C/8M cache/3.4GHz/Max. TDP 77W)Intel® Core i5-3550S (4C/6M cache/3.0GHz/Max. TDP 65W)Intel® Core i3-3220 (2C/3M cache/2.4GHz/Max. TDP 55W)Intel® Pentium® G2120 (2C/3M cache/1.6GHz/Max. TDP 65W) |
| Main Memory | Dual DDR3/DIMMs, support 1333/1600MHz non-ECC system memory up to 16GB |
| Platform Control Hub | Intel® B75 PCH chipset |
| BIOS | AMI System BIOSPlug and play supportAdvanced power management and advanced configuration & power |
| Display | Intel® HD graphics with DX11 support up to two independent displaysSupports VGA and DVI/HDMI interfaces |
| Audio | HDA interface with PIN header |
| On-board LAN | Intel® 82579LM Gigabit EthernetIntel® 82574l Gigabit EthernetSupport PXE boot from LAN, wake on LAN function |
| I/O Interface | USB: 3.0, 2 x ports through I/O bracket/2 x port through JST ConnectorUSB2.0: 4 x ports through 2.5mm JST connectorsFour SATA Port: one SATA 3.0/three SATA 2.0Four PCI interface/three ISA interface (through ITE8888)Two RJ45 Gigabit Ethernet LAN portsFour series ports (COM2 Supports RS232/422/485, RI pin can supply 5V/12V voltage)Parallel port through box headerKeyboard/mouse interfaceHDA interface through pin header for audio function (optional) |
| Power Requirements | +12V, +5V, +3.3V, +5VSB, +3.3V RTC powerPower source form backplane through golden finger and AUX +12VSupport ATX/AT Power supplies |
| Dimensions | 338.58mm (L) x 122mm (W) |
| Environment | Board level operating temperatures: -15°C to 60°CStorage temperatures: -20°C to 80°CRelative humidity: 10% to 90% (operating, non-condensing) 5% to 95% (non-operating, non-condensing) |
| Certifications | Meet CEFCC Class A |
PICMG 1.0/1.3 BackPlane
PICMG 1.0/1.3 BackPlane
Overview N/A
Features
NBP 0513
PICMG 1.3 5-slot Backplane, 1 SHB Slot, 1 x PCIE x16/ 3 x PCI- Main Feature
- Greater Powers Delivery Capability, Supports High Performance system Host Board and Add-on Card
- Follows PICMG 1.3 Mount Holes
- Supports 1 x PCIE x16/ 3 x PCI
- Power Connector Supports
- ATX Standard Power connector: Max 5A for 20-pin
-Support AT Standard Power connector: Max 5A for 12-pin
-Support +12V, 12V, 5V, 3.3V Power Connector - Compliance with PICMG 1.3 Full-size SBC
Specifications
| System Architecture | 5-slot backplane |
| Dimensions | 317mm (W) x 110mm (L) |
| Slot | 1 x PICMG 1.3 (SHB slot)1 x PCIE x163 x PCI |
| I/O Interface | 2 x SATA |
| Power Input/output | ATX Standard Power connector: Max 5A for 20-pinSupport AT Standard Power connector |
| Environment | Operating temperature: 0°C to 60°CStorage temperature: -20°C to 80°CRelative humidity: Operating 10% to 90%, non-condensing Non-operating 5% to 95%, non-condensing |
| Certifications | CE approvalFCC Class A |
Industrial Motherboard
Industrial Motherboard
Overview
NEX 810 is an industrial motherboard with Micro-ATX form factor, which support 3rd and 2nd generation Intel® Core™ i7/i5/i3 processor and Intel® Celeron® processors. NEX 810 supports dual channel DDR3 1600/1333MHz memory in four long DIMM slots up to 32GB system memory and PCIe x16 (3.0/ 2.0 by CPU).
The B75 PCH supports multiple displays by three DDI (digital display interfaces) using among three HDMI and one VGA ports. Intel® B75 PCH manages up to 1 x SATA 3.0/4 x SATA 2.0 and performs up to 10 x USB (4 x USB 3.0/ 6 x USB 2.0) ports, dual Realtek RTL8111F GbE ports and up to 6 Series ports including 4 x RS232 and 1 x RS-232/422/485. NEX 810 supports PCIe x4, 2 x PCI slots and onboard TPM. NEX 810 could be integrated into 1U/2U/4U rack mounted chassis or Desktop Tower as completed system solution for widely industrial applications in the new era of digital infrastructure with NEXCOM.
Features
NEX 810
Micro-ATX, Socket LGA1155 3rd/2nd Gen. Intel® Core™ & Celeron® Processor Product Family with B75, 4 x DDR3, VGA/3 x HDMI, PCIe x16/PCIe x4/2 x PCI, 2 x GbE /10 x USB/5 x COM- Main Feature
- Support socket LGA1155 for 3rd/2nd generation Intel® Core™ i7/i5/i3 processors and Intel® Celeron® processors
- 4 x DDR3 DIMM socket up to 32GB
- Support dual/triple independent display: 3 x HDMI/VGA
- 2 x GbE, 5 x SATA 3.0/2.0, 10 x USB 3.0/2.0, 5 x COM, 4-in/4-out GPIO, HD Audio
- 1 x PCIe x16, 1 x PCIe x4, 2 x PCI
- TPM onboard
- Support AT/ATX mode by ATX power input
Specifications
| CPU Support | Socket LGA1155, Intel® 3rd or 2nd generation Core™ i7/i5/i3 processors and Intel® Celeron® processors |
| Main Memory | 4 x 240-pin dual channel long DIMMs support DDR3 1600/1333MH up to 32GB, non-ECC, un-buffered system memory |
| Chipset | Intel® B75 PCH |
| BIOS | AMI system BIOSPlug and play support |
| On-board LAN | 2 x Realtek RTL8111F GbE controllerSupport PXE boot from LAN, wake on LAN function2 x RJ45 connectors with LED |
| Display | 3 x HDMI connector (resolution up to 1920 x 1080@60Hz)1 x VGA (resolution up to 1920 x 1200@60Hz) |
| Expansion Slot | 1 x PCIe x16 (gen. 3.0/2.0 by CPU)1 x PCIe x42 x PCI |
| Edge I/O Interfaces | 3 x HDMI1 x VGA2 x RJ45 with dual stack USB 3.0 (blue) and dual stack USB 2.0 (black) connectors1 x Keyboard connector1 x Mouse connector1 x Audio Jack: Line-in/Line-out/Mic-in |
| I/O Interface | USB 3.0: 4 ports ( 2 x USB 3.0 on edge I/O, 2 x internal pin-header)USB 2.0: 6 ports ( 2 x USB 2.0 on edge I/O, 4 x internal pin-header)Serial: 5 ports (1 x RS232/422/485, 4 x RS232 by internal pin-header)SATA HDD: 5 ports (1 x SATA 6.0Gb/s, 4 x SATA 3.0Gb/s)GPIO: supports 4 x GPI and 4 x GPO |
| Interface | 1 x LPT connector, support SPP/EPP/ECP mode1 x 4-pin CPU fan connector; 1 x 4-pin chassis fan connector2 x front panel header; 1 x IrDA header; 1 x CMOS jumper,1 x BIOS flash header (2 x 4P, P=1.27mm) |
| System Monitor | 4 voltage (for +3.3V/+5V, +12V, Vcore)2 temperatures (CPU, system temperatures)2 fans speed (CPU and system fans) |
| Power Requirements | 1 x 24-pin ATX connector,1 x 8-pin ATX 12V power connector |
| Dimensions | Micro ATXDimension: 244mm (L) x 244mm (W) (9.6” x 9.6”) |
| Environment | Board level operating temperatures: 0˚C to 60˚CStorage temperatures: -40˚C to 85˚CRelative humidity: - 0% to 90% (operating, non-condensing) - 5% to 95% (non-operating, non-condensing) |
| Certifications | Meet CE/FCC Class A |
